Silica Sol (siblings)
CMP-Grade Silica Sol for Wafer Polishing
Chemical-mechanical polishing (CMP) silica sol is ultra-high-purity colloidal silica used for semiconductor wafer surface planarization and photovoltaic silicon wafer polishing. Trace metal content typically below 1 ppm; particle size strictly controlled (D50 30-80 nm) for required surface roughness.
Specifications
| Particle Size (D50) | 30-80 nm |
| Particle Uniformity (CV) | Below 15% |
| SiO₂ Content | 20-30 wt% |
| Trace Metals | Below 1 ppm (semiconductor grade) |
| pH | 9.5-10.5 (KOH stabilized) |
Applications
- Semiconductor wafer surface planarization
- Photovoltaic silicon wafer polishing
- Sapphire substrate polishing
- Optical glass polishing
- Hard disk substrate polishing
Key Features
- Ultra-high purity (semiconductor grade)
- Strictly controlled particle size distribution
- Excellent material removal rate
- Surface roughness (Ra) achievable below 0.5 nm
- Compatible with all major CMP equipment platforms
Send Inquiry
Grade
Semiconductor / PV CMP
Particle Size
30-80 nm
Trace Metals
Below 1 ppm
Sample
Within 5 business days
Availability
In Stock