Silicone Grease (siblings)
Thermally Conductive Silicone Grease (TIM)
Thermally conductive silicone grease (TIM) bridges the heat path between CPU/GPU/power-module dies and heat sinks. Typical thermal conductivity 1.0-6.0 W/m·K depending on filler choice (Al₂O₃, ZnO, AlN, BN). Applied in 50-200 μm bondline; re-pasteable for service.
Specifications
| Thermal Conductivity | 1.0-6.0 W/m·K (typical), up to 14.0 W/m·K premium |
| Bondline Thickness | 50-200 μm typical |
| Service Temperature | -50 °C to +200 °C |
| Bleed (24h, 200 °C) | Below 5% |
| Volume Resistivity | Above 10¹⁴ Ω·cm |
Applications
- CPU and GPU thermal pasting
- Server and data-center cooling
- Power-module thermal interface (IGBT, MOSFET)
- LED-heatsink thermal grease
- Automotive ECU and inverter cooling
Key Features
- Re-pasteable for service maintenance
- Wide temperature range (-50 to +200 °C)
- Electrically insulating (above 10¹⁴ Ω·cm)
- Long-term stability without dry-out
- Multiple filler chemistries for cost/performance balance
Send Inquiry
TC Range
1.0-14.0 W/m·K
Application
CPU/GPU TIM
BLT
50-200 μm
Sample
Within 5 business days
Availability
In Stock